![]() The "Input Data" spreadsheet includes shaded cells where the user defines the parameters in the cost models that can be modified to simulate different situations. The "Introduction" spreadsheet briefly explains these cost models, summarizes the required input data and provides the formulae used in the calculations.Ģ. This workbook is organized into seven spreadsheets to facilitate data input and visualization of results:ġ. The important mathematical formulas also are displayed below. Leachman, John Plummer and Nancy Sato-Misawa. Manufacturing (CSM) Program Report "Understanding Fab Economics", CSM-47, authored by Robert C. These models are explained in detail for the static wafer-starts case in the Competitive Semiconductor Our Delay Cost Model expresses a die cost equivalent to the foregone revenues resulting from delays for process development and qualification, equipment installation and qualification, factory construction, time to ramp die yield, and manufacturing cycle time. Delays for fab construction, process development and qualification, equipment installation and qualification, yield ramp, and manufacturing cycle time depress revenues obtained from the process technology over its life. The calculation of fab revenues accounts for a user-specified decline of die prices over time. Important differences compared to CRM include (1) staffing costs are computed for varying levels of fab automation, and (2) equipment performance is defined by the user in terms of theoretical throughput rates and capability for equipment efficiency (CEE), rather than average throughput rates and equipment availability as is traditionally done using CRM. ![]() In order to compute wafer and die costs, all wafers and die produced over the life of the technology are burdened equally with capital expenses. This model accounts for expenses of fab construction and operation. ![]() The calculation of fab expenses uses an enhanced version of SEMATECH's Cost-Resource Model (CRM). Higher yields in this case result in higher die throughput for the given equipment set and both higher revienues and lower costs per wafer. In case (2), higher equipment efficiencies or reduced process times result in higher wafer throughput for the given equipment set and hence both higher revenues and lower costs per wafer. Higher yields in this case result in reduced investment costs as well as higher revenues for the given wafer start volumes. ![]() In case (1), higher equipment efficiencies or reduced process times result in reduced investment in equipment and facilities to accommodate the pre-specified wafer starts. The user may compute costs and revenues for one of two basic cases: (1) wafer start volumes are pre-specified over time, or (2) equipment counts are pre-specified over time. ![]() Cash flows for both expenditures and revenues from fabrication are computed.Īt present, the models assume the fabrication line operates a single process technology consisting of up to 300 major process steps utilizing up to 50 major types of process equipment. The intent is to provide the engineering analyst with the means to evaluate the economic impacts of changes to process and equipment, changes in the timing of when process or equipment are installed and qualified, changes in the time to ramp up die yield, and changes in manufacturing cycle time. This Excel workbook provides spreadsheet models for calculating revenues and costs of wafer fabrication. Related Resources: excel calculators Competitive Semiconductor Manufacturing (CSM) Program Excel SpreadsheetĮxcel Engineering Calculators | Engineering CalculatorsĬompetitive Semiconductor Manufacturing (CSM) Program Excel Spreadsheetĭownload: Competitive Semiconductor Manufacturing (CSM) Program Excel Spreadsheet ![]()
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